Recently, Qualcomm had introduced its new Snapdragon 845 mobile platform which comes with some great features. After that, the Chinese smartphone maker Xiaomi announced that its Mi 7 would be the first device which will come with the Snapdragon 845 SoC. With the latest SoC, the device is expected to come with a full-screen design as the Mi MIX 2 has. Well, the new concept renders has given some information about the design of the Mi 7.
As pert the new renders, the device comes with a full-screen design and carry very thin bezels. In lower side of the front, it has a very slim bezel, and the upper bezel is little thick which consist the front camera. The Xiaomi Mi 7 will carry high screen-to-body ratio, and the aspect ratio will be 18:9. The renders show it has a curved glass panel. Coming to its rear side, the device carries dual rear camera set up and positioned vertically. The LED flash is fitted in the middle of the two camera lens.
As per the previous leaked information, the device may come with a 6.01 inch OLED display with 18:9 aspect ratio. The device is expected to be powered by the Qualcomm Snapdragon 845 chipset. It is the latest 2018 flagship chipset of Qualcomm.
The device may come with a 6 GB of RAM. It will come with the dual camera set up on the back side. The major highlight of the camera is it will carry the AI technology. The new Snapdragon 845 SoC has the power to give AI capabilities while taking photographs. With this, the Mi 7 will give better quality photographs in the low light environment. The Mi 7 with the Snapdragon 845 chipset will carry a 12 MP Sony IMX380 sensor and a 20MP Sony IMZ350 sensor on its rear side. With all these combinations it will enhance the photography experience.
Some leaked report has stated that the device would come with wireless charging technology. It is expected that the device will come with a price tag of 2699 Yuan.