Apple will release its next-generation iPhone models in 2018 as per the report the devices will feature Intel’s XMM 7560 and Qualcomm’s Snapdragon X20 modems. Which will give enhanced data transmission speed to the devices. This information has given by KGI Securities analyst Ming-Chi Kuo.
Kuo stated that both the new chips support 4×4 MIMO technology, compared to only 2×2 MIMO in the latest iPhone models, which leads him to believe LTE transmission speeds will increase significantly in 2018 iPhones. Apart from this, Kuo also predicted that Intel would supply around 70 to 80 percent or more of the baseband chips to Apple which will be fitted into Apple’s upcoming devices.
“New baseband chips from Intel & Qualcomm will significantly boost transmission speed of new 2H18 iPhone models thanks to supporting 4×4 MIMO antenna design: We believe that 2H18 new iPhones will upgrade baseband chips from Intel’s XMM 7480 and Qualcomm’s MDM 9655 in 2H17 to Intel’s XMM 7560 and Qualcomm’s SDX 20. As both new chips support 4×4 MIMO technology, compared to only 2×2 MIMO in 2H17, we anticipate LTE transmission speeds will increase significantly. We believe Intel will supply Apple with 70-80% or more of required baseband chips” Kuo predicted.
Information also says that iPhone’s 2018 models will feature dual-SIM dual standby, with support for LTE+LTE connections, which allows two SIM cards to be active simultaneously using only one set of chips.
“2H18 iPhone models won’t only offer faster LTE transmission speed: We predict that at least one of the 2H18 new iPhone models will support dual-SIM dual standby (DSDS). Unlike existing DSDS phones, which commonly support LTE+3G connections, we believe next-generation iPhone models will support LTE+LTE connections, in a bid to enhance the user experience,” Kuo informed.
Ming-Chi Kuo has been predicted many things about Apple, and till now all those predictions have come true. That means Apple will adopt this technology and will give dual SIM support devices in 2018.